Accredited to Automotive Standards

Every certification listed is current, externally audited, and available for customer review during supplier qualification.

IATF 16949:2016

Automotive QMS

The global standard for automotive quality management systems. Our IATF 16949 certification covers all automotive product lines across both Shenzhen facilities. Annual surveillance audits with zero major non-conformances since initial certification.

AEC-Q100 / Q200

Component Qualification

AEC-Q100 (IC) and AEC-Q200 (passive) qualification testing for all components in our automotive BOM. We maintain an approved vendor list (AVL) restricted to AEC-Q qualified components for automotive production.

ISO 26262

Functional Safety

ISO 26262-compliant processes for ASIL-C safety-related systems. Our safety case documentation includes HARA, safety goals, functional safety concept, and technical safety requirements for BMS and ADAS products.

IPC-A-610

Class 3 Acceptance

All automotive production lines are certified to IPC-A-610 Class 3 (High Performance Electronic Products). Every operator undergoes annual re-certification. Zero field returns on Class 3 production for three consecutive fiscal years.

ISO 14001

Environmental Management

Environmental management system covering waste handling, RoHS compliance, REACH substance tracking, and conflict minerals reporting. Aligned with global OEM sustainability requirements.

ASPICE

Software Process

Automotive SPICE Level 3 processes for embedded software development on our BMS, OBC, and Sensor Fusion products. Software V-model with requirements traceability and unit/integration testing.

APQP: Gated Development Process

Every new product introduction follows the AIAG APQP framework with five controlled phases and formal gate reviews.

P1
Plan & Define
Customer requirements
Business case
Design targets
P2
Product Design
DFMEA
Design verification
Prototype build
P3
Process Design
PFMEA
Control plan
Process flow chart
P4
Validation
MSA
SPC capability
PPAP submission
P5
Production
SPC monitoring
Continuous improvement
Customer feedback

Gateway Review Structure

G0
Concept Approval
G1
Design Release
G2
Process Ready
G3
PPAP Sign-Off
G4
SOP + SPC

Production Part Approval Process

We deliver complete PPAP Level 3 documentation packages for every automotive project. Below are the core AIAG quality tools embedded in our process.

PPAP

AIAG PPAP 4th Edition

Complete Level 3 submission: PSW, design records, engineering change documents, DFMEA, PFMEA, process flow diagram, control plan, MSA results, dimensional results, material certs, initial process capability studies, and sample production parts.

FMEA

AIAG/VDA FMEA Handbook

Design FMEA and Process FMEA aligned with the harmonized AIAG/VDA standard. Seven-step FMEA process with action priority (AP) replacing RPN. Linked to control plan and process flow documentation.

SPC

AIAG SPC 2nd Edition

Statistical process control on all critical characteristics. Real-time X-bar/R charts with automated out-of-control action plan (OCAP) triggers. Cpk >= 1.67 target for all special characteristics.

MSA

AIAG MSA 4th Edition

Measurement system analysis including Gauge R&R studies (ANOVA method), bias, linearity, and stability studies for all inspection equipment. GR&R < 10% for all critical measurement systems.

In-House Test Capabilities

All environmental and reliability testing performed on-site, reducing validation cycle time and enabling rapid design iteration during NPI.

-40+125°C

Thermal Cycling

Rapid temperature cycling from -40°C to +125°C per AEC-Q100 and ISO 16750-4. Liquid-to-liquid thermal shock for solder joint reliability assessment.

Range: -65°C to +150°C | Ramp: 40°C/min | Chambers: 4

Vibration & Mechanical Shock

Random and sine-sweep vibration per ISO 16750-3 and AEC-Q100. Mechanical shock testing up to 50g. Combined temperature + vibration (HALT) capability.

Frequency: 10-2000 Hz | Shock: 50g | HALT Chambers: 2

EMC Pre-Compliance

Conducted and radiated emissions pre-compliance testing to CISPR 25. Bulk current injection (BCI), ESD testing per ISO 10605. TEM cell and near-field probe scanning.

Frequency: 150 kHz - 6 GHz | ESD: 25kV | CISPR 25

Salt Spray & Corrosion

Neutral salt spray (NSS) testing per ISO 9227 and ASTM B117. Mixed flowing gas (MFG) for connector reliability. Condensation testing per ISO 16750-4.

Duration: 1000h+ | ISO 9227, ASTM B117 | MFG per IEC 60068-2-60

X-Ray & Optical Inspection

Automated 3D X-ray inspection (AXI) for BGA, QFN, and hidden solder joints. Automated optical inspection (AOI) with 10-micron resolution. Cross-sectioning lab for failure analysis.

AXI: 3-micron resolution | AOI: 10-micron | Cross-section lab

ICT & Functional Test

In-circuit test (ICT) with 100% coverage of passive components. Flying probe for prototype validation. Custom functional test fixtures with automotive communication bus simulation (CAN/LIN/FlexRay).

ICT: 100% coverage | CAN/LIN/Ethernet bus sim | Custom fixtures

Component to Vehicle Traceability

Every PCBA carries a unique 2D data matrix code linking to its complete manufacturing record: BOM revision, component date codes, SMT machine parameters, AOI results, and test data. This data is archived for the product lifetime plus 15 years per IATF 16949 requirements.

S/N: EMS-2026-08-0015423-B1 | Rev: C | Date: 2026-W27

Audit Us

We welcome customer quality audits at both Shenzhen facilities. Request our IATF 16949 certificate, site audit schedule, or schedule a virtual plant tour with our quality team.